Phenolic
Material Information
Specifications
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.35 - 2.13 g/cc | 0.0488 - 0.0770 lb/in³ | Average value: 1.49 g/cc Grade Count:15 |
Water Absorption | 0.0300 - 0.500 % | 0.0300 - 0.500 % | Average value: 0.303 % Grade Count:15 |
Linear Mold Shrinkage | 0.000400 - 0.0140 cm/cm | 0.000400 - 0.0140 cm/cm | Average value: 0.00826 cm/cm Grade Count:15 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Rockwell E | 86.0 - 91.0 | 86.0 - 91.0 | Average value: 88.3 Grade Count:3 |
Tensile Strength, Ultimate | 41.0 - 57.9 MPa | 5950 - 8400 psi | Average value: 53.2 MPa Grade Count:15 |
Modulus of Elasticity | 4.10 - 8.64 GPa | 595 - 1250 ksi | Average value: 7.00 GPa Grade Count:5 |
Flexural Yield Strength | 76.0 - 109 Mpa | 11000 - 15800 psi | Average value: 85.6 MPa Grade Count:15 |
Flexural Modulus | 7.53 - 19.0 Gpa | 1090 - 2760 ksi | Average value: 11.5 GPa Grade Count:3 |
Compressive Yield Strength | 183 - 226 MPa | 26600 - 32800 psi | Average value: 206 MPa Grade Count:15 |
Izod Impact, Notched | 0.210 - 0.320 J/cm | 0.393 - 0.599 ft-lb/in | Average value: 0.270 J/cm Grade Count:14 |
Charpy Impact, Notched | 0.190 - 0.390 J/cm² | 0.904 - 1.86 ft-lb/in² | Average value: 0.305 J/cm² Grade Count:13 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Electrical Resistivity | 1.00e+11 - 1.00e+13 ohm-cm | 1.00e+11 - 1.00e+13 ohm-cm | Average value: 4.26e+12 ohm-cm Grade Count:15 |
Insulation Resistance | 1.00e+8 - 1.00e+11 ohm | 1.00e+8 - 1.00e+11 ohm | Average value: 2.78e+10 ohm Grade Count:10 |
Dielectric Constant | 5.00 - 6.50 | 5.00 - 6.50 | Average value: 5.64 Grade Count:5 |
Dielectric Strength | 8.86 - 13.8 kV/mm | 225 - 351 kV/in | Average value: 11.3 kV/mm Grade Count:15 |
Dissapation Factor | 0.0190 - 0.0800 | 0.0190 - 0.0800 | Average value: 0.0540 Grade Count:5 |
Arc Resistance | 120 - 190 sec | 120 - 190 sec | Average value: 145 sec Grade Count:8 |
Comparative Tracking Index | 100 - 250 V | 100 - 250 V | Average value: 160 V Grade Count:13 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
Thermal Conductivity | 0.940 - 0.940 W/m-K @ Temp 100°C | 6.52 - 6.52 BTU-in/hr-ft²-°F @ Temp 212°F | Average value: 0.940 W/m-K Grade Count:1 |
Maximum Service Temperature, Air | 150 - 219 °C | 302 - 426 °F | Average value: 185 °C Grade Count:15 |
Deflection Temperature at 1.8 Mpa (264 psi) | 160 - 226 °C | 320 - 439 °F | Average value: 176 °C Grade Count:15 |
Flammability, UL94 | HB - V-0 | HB - V-0 | Grade Count:14 |
NOTE: The information in this data sheet is for design guidance only. Forming methods and specific geometry could affect properties.
Overview
Phenolic Laminates are made by applying heat and pressure to layers of paper, canvas, linen or glass cloth impregnated with synthetic thermosetting resins. Which offers excellent physical strength, resiliency, ease and versatility of fabrication. They don’t soften upon re-heating, so they are easy to saw, drill, tap, and machine with ordinary tools. Suited for support components in a wide range of mechanical and electrical applications because they resist corrosion and provide electrical insulation. Material data provided by Boedeker Plastics.
Applications & Usage
- Source Handles
- PCB Standoffs
- Insulating Washers
- Spacers
- Signage
- Terminal Boards
- Conveyor System Guides
- Injection Molding
- Electrical components like switch bases, piston rings, relay bases and radio parts
- Intricate items such as punch parts, strainers, guards, screens and partitions
- Machined parts such as gears, rollers, bushings and fasteners
Industries Using This Material
Semiconductor
One of the original second source providers, Glemco has been manufacturing products in the US in support of the semiconductor industry for over 40 years. Our extensive history means that we can support the oldest legacy equipment or the newest cutting-edge implant technology, with available upgrades and enhancements to drive efficiency, reliability and performance improvements.
Semiconductor
One of the original second source providers, Glemco has been manufacturing products in the US in support of the semiconductor industry for over 40 years. Our extensive history means that we can support the oldest legacy equipment or the newest cutting-edge implant technology, with available upgrades and enhancements to drive efficiency, reliability and performance improvements.
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Telcom
Precisely crafted components are necessary to support this rapidly changing industry. Poor quality here can contribute to lost time around the globe. Our multi axis machining capabilities allow us to create highly accurate complex parts from a variety of high strength materials.
Telcom
Precisely crafted components are necessary to support this rapidly changing industry. Poor quality here can contribute to lost time around the globe. Our multi axis machining capabilities allow us to create highly accurate complex parts from a variety of high strength materials.
Packaging
We can support emergency repair, produce a legacy part from your sample, and stock high wear parts no longer supported by the OEM. Our expert team can also help you bring your packaging design concept to reality.
Packaging
We can support emergency repair, produce a legacy part from your sample, and stock high wear parts no longer supported by the OEM. Our expert team can also help you bring your packaging design concept to reality.